Research
Metal Additive Manufacturing (AM)
Metal Additive Manufacturing (AM)
- Blue laser-based metal AM
- Process monitoring and control
- Novel materials processing
- Data-driven process prediction modeling
Semiconductor Packaging Processes
Semiconductor Packaging Processes
- Laser-assisted process (chip bonding, SiC wafer slicing, microLED chip transfer)
- Real-time temperature measurement of processes
- in-situ thermal characterization of processes
Thermal Characterization using laser spectroscopy
Thermal Characterization using laser spectroscopy
- Discovering a new regime of thermal transport in solids
- Thermal properties for novel materials